SK hynix Breaks Ground on $4 Billion Indiana HBM Production Facility
SK hynix held a groundbreaking ceremony on August 27 at Purdue University in West Lafayette, Indiana, for an advanced packaging production facility dedicated to AI memory. The event was attended by Indiana Governor Mike Braun, US Senator Todd Young, Purdue University President Mitch Daniels, and Robert Abrams, Chairman of the Korea-US Alliance Foundation, as well as SK Group Vice Chairmen Yu Jeong-Joon and Lee Hyung-hee, and SK hynix CEO Kwak Noh-Jung. South Korean Ambassador to the United States Kang Kyung-wha also attended.
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